9781890659851-1890659851-Soares Book on Grounding and Bonding, NEC-2020

Soares Book on Grounding and Bonding, NEC-2020

ISBN-13: 9781890659851
ISBN-10: 1890659851
Edition: 14
Author: International Association of Electrical Inspectors, L Keith Lofland, Joseph Wages Jr., Laura Hildreth, Charles Mello
Publication date: 2020
Publisher: International Association of Electrical Inspectors
Format: Perfect Paperback 440 pages
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Book details

ISBN-13: 9781890659851
ISBN-10: 1890659851
Edition: 14
Author: International Association of Electrical Inspectors, L Keith Lofland, Joseph Wages Jr., Laura Hildreth, Charles Mello
Publication date: 2020
Publisher: International Association of Electrical Inspectors
Format: Perfect Paperback 440 pages

Summary

Soares Book on Grounding and Bonding, NEC-2020 (ISBN-13: 9781890659851 and ISBN-10: 1890659851), written by authors International Association of Electrical Inspectors, L Keith Lofland, Joseph Wages Jr., Laura Hildreth, Charles Mello, was published by International Association of Electrical Inspectors in 2020. With an overall rating of 4.4 stars, it's a notable title among other books. You can easily purchase or rent Soares Book on Grounding and Bonding, NEC-2020 (Perfect Paperback) from BooksRun, along with many other new and used books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.52.

Description

Updated to the 2020 National Electrical CodeĀ®. The newest 14th edition of Soares Book on Grounding and Bonding has also been revised to provide a better flow of the information to align closer to what designers and installers will experience in an actual project. Why be stumped by the electrical concepts of grounding and bonding? Bring it down to earth with this updated material. This new edition has been newly broken down into three parts to help inspectors and installers find the Code-related information they need to promote electrical safety: Part I - Grounding and Bonding Fundamentals; Part II - Grounding and Bonding Common Applications; and Part III - Grounding and Bonding of Specific Applications.

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