Copper Wire Bonding
ISBN-13:
9781493953493
ISBN-10:
1493953494
Edition:
Softcover reprint of the original 1st ed. 2014
Author:
Michael G. Pecht, Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong
Publication date:
2016
Publisher:
Springer
Format:
Paperback
261 pages
FREE US shipping
Book details
ISBN-13:
9781493953493
ISBN-10:
1493953494
Edition:
Softcover reprint of the original 1st ed. 2014
Author:
Michael G. Pecht, Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong
Publication date:
2016
Publisher:
Springer
Format:
Paperback
261 pages
Summary
Copper Wire Bonding (ISBN-13: 9781493953493 and ISBN-10: 1493953494), written by authors
Michael G. Pecht, Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, was published by Springer in 2016.
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Description
Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.
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