9781461492627-1461492629-Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

ISBN-13: 9781461492627
ISBN-10: 1461492629
Edition: 2015
Author: Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong
Publication date: 2014
Publisher: Springer
Format: Hardcover 417 pages
FREE US shipping
Buy

From $41.70

Book details

ISBN-13: 9781461492627
ISBN-10: 1461492629
Edition: 2015
Author: Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong
Publication date: 2014
Publisher: Springer
Format: Hardcover 417 pages

Summary

Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems) (ISBN-13: 9781461492627 and ISBN-10: 1461492629), written by authors Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong, was published by Springer in 2014. With an overall rating of 3.7 stars, it's a notable title among other Electrical & Electronics (Engineering) books. You can easily purchase or rent Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems) (Hardcover) from BooksRun, along with many other new and used Electrical & Electronics books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $2.32.

Description

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Rate this book Rate this book

We would LOVE it if you could help us and other readers by reviewing the book