Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
ISBN-13:
9781461492627
ISBN-10:
1461492629
Edition:
2015
Author:
Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong
Publication date:
2014
Publisher:
Springer
Format:
Hardcover
417 pages
Category:
Electrical & Electronics
,
Engineering
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Book details
ISBN-13:
9781461492627
ISBN-10:
1461492629
Edition:
2015
Author:
Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong
Publication date:
2014
Publisher:
Springer
Format:
Hardcover
417 pages
Category:
Electrical & Electronics
,
Engineering
Summary
Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems) (ISBN-13: 9781461492627 and ISBN-10: 1461492629), written by authors
Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong, was published by Springer in 2014.
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Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
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