Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science (ISBN-13: 9780930815257 and ISBN-10: 0930815254), written by authors George Harman, was published by Intl Society of Hybrid in 1989. With an overall rating of 4.5 stars, it's a notable title among other Electrical & Electronics (Technology, Engineering) books. You can easily purchase or rent Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science (Hardcover) from BooksRun, along with many other new and used Electrical & Electronics books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.48.