9780471964889-0471964883-Joining Processes: An Introduction

Joining Processes: An Introduction

ISBN-13: 9780471964889
ISBN-10: 0471964883
Edition: 1
Author: David Brandon, Wayne D. Kaplan
Publication date: 1997
Publisher: John Wiley & Sons
Format: Paperback 378 pages
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Book details

ISBN-13: 9780471964889
ISBN-10: 0471964883
Edition: 1
Author: David Brandon, Wayne D. Kaplan
Publication date: 1997
Publisher: John Wiley & Sons
Format: Paperback 378 pages

Summary

Joining Processes: An Introduction (ISBN-13: 9780471964889 and ISBN-10: 0471964883), written by authors David Brandon, Wayne D. Kaplan, was published by John Wiley & Sons in 1997. With an overall rating of 4.2 stars, it's a notable title among other Industrial, Manufacturing & Operational Systems (Engineering, Nanotechnology, Technology) books. You can easily purchase or rent Joining Processes: An Introduction (Paperback) from BooksRun, along with many other new and used Industrial, Manufacturing & Operational Systems books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.3.

Description

This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

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