Physical Architecture of Vlsi Systems

Presents an up-to-date, pragmatic overview of packaging and interconnect technology from the perspective of workers in the field, as a reference for practicing engineers in both microelectronic packaging and in general electronic system design, or as a supplemental text at the advanced undergraduate or graduate level, assuming previous exposure to the fundamental engineering sciences (mechanics, electromagnetics, heat transfer, and materials science). It emphasizes the interaction and trade-offs required across the various disciplines in the realization of effective product designs. Annotation copyright Book News, Inc. Portland, Or.