9780195105087-0195105087-The Science and Engineering of Microelectronic Fabrication (The ^AOxford Series in Electrical and Computer Engineering)

The Science and Engineering of Microelectronic Fabrication (The ^AOxford Series in Electrical and Computer Engineering)

ISBN-13: 9780195105087
ISBN-10: 0195105087
Author: Stephen A. Campbell
Publication date: 1996
Publisher: Oxford University Press
Format: Hardcover 560 pages
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Book details

ISBN-13: 9780195105087
ISBN-10: 0195105087
Author: Stephen A. Campbell
Publication date: 1996
Publisher: Oxford University Press
Format: Hardcover 560 pages

Summary

The Science and Engineering of Microelectronic Fabrication (The ^AOxford Series in Electrical and Computer Engineering) (ISBN-13: 9780195105087 and ISBN-10: 0195105087), written by authors Stephen A. Campbell, was published by Oxford University Press in 1996. With an overall rating of 3.6 stars, it's a notable title among other Telecommunications & Sensors (Engineering) books. You can easily purchase or rent The Science and Engineering of Microelectronic Fabrication (The ^AOxford Series in Electrical and Computer Engineering) (Hardcover) from BooksRun, along with many other new and used Telecommunications & Sensors books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.07.

Description

The Science and Engineering of Microelectronic Fabrication provides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.

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