9780412084416-0412084414-Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)

Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)

ISBN-13: 9780412084416
ISBN-10: 0412084414
Edition: 2nd
Author: Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
Publication date: 1997
Publisher: Springer
Format: Hardcover 1030 pages
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Book details

ISBN-13: 9780412084416
ISBN-10: 0412084414
Edition: 2nd
Author: Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
Publication date: 1997
Publisher: Springer
Format: Hardcover 1030 pages

Summary

Acknowledged authors Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G. wrote Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1) comprising 1030 pages back in 1997. Textbook and eTextbook are published under ISBN 0412084414 and 9780412084416. Since then Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1) textbook was available to sell back to BooksRun online for the top buyback price or rent at the marketplace.

Description

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

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