Sell, buy or rent Beth Keser textbooks
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (IEEE Press)
by
Beth Keser, Steffen Kröhnert
ISBN-13: 9781119314134
ISBN-10: 1119314135
Edition: 1
Publication date: 2019
Publisher:
Wiley-IEEE Press
Format:
Hardcover
576 pages
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
by
Beth Keser, Steffen Krouml;hnert
ISBN-13: 9781119793779
ISBN-10: 1119793777
Edition: 1
Publication date: 2021
Publisher:
Wiley-IEEE Press
Format:
Hardcover
320 pages