9783527326464-3527326464-Handbook of Wafer Bonding

Handbook of Wafer Bonding

ISBN-13: 9783527326464
ISBN-10: 3527326464
Edition: 1
Author: Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Publication date: 2012
Publisher: Wiley-VCH
Format: Hardcover 425 pages
FREE US shipping

Book details

ISBN-13: 9783527326464
ISBN-10: 3527326464
Edition: 1
Author: Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Publication date: 2012
Publisher: Wiley-VCH
Format: Hardcover 425 pages

Summary

Handbook of Wafer Bonding (ISBN-13: 9783527326464 and ISBN-10: 3527326464), written by authors Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo, was published by Wiley-VCH in 2012. With an overall rating of 4.5 stars, it's a notable title among other Materials & Material Science (Engineering) books. You can easily purchase or rent Handbook of Wafer Bonding (Hardcover) from BooksRun, along with many other new and used Materials & Material Science books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.3.

Description

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Rate this book Rate this book

We would LOVE it if you could help us and other readers by reviewing the book