9783527326464-3527326464-Handbook of Wafer Bonding

Handbook of Wafer Bonding

ISBN-13: 9783527326464
ISBN-10: 3527326464
Edition: 1
Publication date: 2012
Publisher: Wiley-VCH
Format: Hardcover 425 pages
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Book details

ISBN-13: 9783527326464
ISBN-10: 3527326464
Edition: 1
Publication date: 2012
Publisher: Wiley-VCH
Format: Hardcover 425 pages

Summary

Acknowledged author wrote Handbook of Wafer Bonding comprising 425 pages back in 2012. Textbook and eTextbook are published under ISBN 3527326464 and 9783527326464. Since then Handbook of Wafer Bonding textbook was available to sell back to BooksRun online for the top buyback price or rent at the marketplace.

Description

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

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