Bundle: Engineering Design Process, Loose-leaf Version, 3rd + MindTap Engineering, 1 term (6 months) Printed Access Card

Acknowledged authors Haik, Yousef, Sivaloganathan, Sangarappillai, Shahin, Tamer M. wrote Bundle: Engineering Design Process, Loose-leaf Version, 3rd + MindTap Engineering, 1 term (6 months) Printed Access Card comprising pages back in 2017. Textbook and eTextbook are published under ISBN 1337594229 and 9781337594226. Since then Bundle: Engineering Design Process, Loose-leaf Version, 3rd + MindTap Engineering, 1 term (6 months) Printed Access Card textbook was available to sell back to BooksRun online for the top buyback price or rent at the marketplace.