9780306450457-0306450453-Advances in X-Ray Analysis, Vol. 38

Advances in X-Ray Analysis, Vol. 38

ISBN-13: 9780306450457
ISBN-10: 0306450453
Edition: 1995
Author: Ron Jenkins, John V. Gilfrich, I. Cev Noyan, Ting C. Huang, Deane K. Smith, Paul K. Predecki, D.K. Bowen, C.C. Goldsmith
Publication date: 1995
Publisher: Springer
Format: Hardcover 813 pages
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Book details

ISBN-13: 9780306450457
ISBN-10: 0306450453
Edition: 1995
Author: Ron Jenkins, John V. Gilfrich, I. Cev Noyan, Ting C. Huang, Deane K. Smith, Paul K. Predecki, D.K. Bowen, C.C. Goldsmith
Publication date: 1995
Publisher: Springer
Format: Hardcover 813 pages

Summary

Advances in X-Ray Analysis, Vol. 38 (ISBN-13: 9780306450457 and ISBN-10: 0306450453), written by authors Ron Jenkins, John V. Gilfrich, I. Cev Noyan, Ting C. Huang, Deane K. Smith, Paul K. Predecki, D.K. Bowen, C.C. Goldsmith, was published by Springer in 1995. With an overall rating of 3.6 stars, it's a notable title among other Electrical & Electronics (Engineering, Astronomy, Astronomy & Space Science, Analytic, Chemistry, General & Reference) books. You can easily purchase or rent Advances in X-Ray Analysis, Vol. 38 (Hardcover) from BooksRun, along with many other new and used Electrical & Electronics books and textbooks. And, if you're looking to sell your copy, our current buyback offer is $0.43.

Description

The 43rd Annual Conference on Applications ofX-ray Analysis was held August 1-5, 1994, at the Sheraton Steamboat Resort & Conference Center in Steamboat Springs, Colorado. The Denver X-Ray Conference has evolved from the 1950's into an international forum for the interaction of scientists, engineers and technologists interested in the use of x-rays in materials characterization. It has not only acted as a venue but has both stimulated and nurtured many of the principal developments in this field over the years. The major changes that have been occurring on the national and international scene as a result of the end of the cold war have dramatic-ally affected the way the materials community does business. The removal of defense priorities and development funds from most new materials initiatives has stimulated the char acterization communities to look to increasing the speed of their methods. This is being accom plished via the development of very fast dynamic characterization procedures which can rapidly and intelligently monitor and optimize the formation of a desired microstructure. The develop ment of intelligent characterization procedures applied in real-time during the manufacturing process can lead to the ability to design desired microstructures. Another potential advantage to this approach is its ability to characterize the actual amount of material which goes into a final product; permitting a rapid transition from R&D to manufacturing by avoiding the prob lems associated with scale-up.

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