System on Package: Miniaturization of the Entire System
ISBN-13:
9780071459068
ISBN-10:
0071459065
Edition:
1
Author:
Rao Tummala
Publication date:
2008
Publisher:
McGraw Hill
Format:
Hardcover
785 pages
FREE US shipping
Book details
ISBN-13:
9780071459068
ISBN-10:
0071459065
Edition:
1
Author:
Rao Tummala
Publication date:
2008
Publisher:
McGraw Hill
Format:
Hardcover
785 pages
Summary
System on Package: Miniaturization of the Entire System (ISBN-13: 9780071459068 and ISBN-10: 0071459065), written by authors
Rao Tummala, was published by McGraw Hill in 2008.
With an overall rating of 4.5 stars, it's a notable title among other
Internet, Groupware, & Telecommunications
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Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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