9780071459068-0071459065-System on Package: Miniaturization of the Entire System

System on Package: Miniaturization of the Entire System

ISBN-13: 9780071459068
ISBN-10: 0071459065
Edition: 1
Author: Tummala, Rao
Publication date: 2008
Publisher: McGraw-Hill Education
Format: Hardcover 785 pages
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Book details

ISBN-13: 9780071459068
ISBN-10: 0071459065
Edition: 1
Author: Tummala, Rao
Publication date: 2008
Publisher: McGraw-Hill Education
Format: Hardcover 785 pages

Summary

Acknowledged authors Tummala, Rao wrote System on Package: Miniaturization of the Entire System comprising 785 pages back in 2008. Textbook and eTextbook are published under ISBN 0071459065 and 9780071459068. Since then System on Package: Miniaturization of the Entire System textbook was available to sell back to BooksRun online for the top buyback price or rent at the marketplace.

Description

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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